gotMIC - MMIC's

Amplifiers	Development Boards	Mixers
Multifunctional Devices	Multipliers	Switches

DIE Attach and Wire Bonding:

MMICs are all back metalized which also serves as ground. The back side must be both electrically and thermally connected using soldering or epoxy with high thermal and electrical conductivity. Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the square gold bond pads. Bond force, time, ultrasonic power and temperature are all critical parameters for good attachment. For additional information please refer to the Assembly Guidelines or the Handling Instructions.  For further information about gotMIC MMICs, visit our MMIC Design Center to download more articles.

Example of an E Band receiver in an SMD package, mounted on a development board